av免费福利片在线播放,99热精品久久只有精品,18video性欧美19sex,ysl蜜桃色www,国产精品一区二区久久国产

AMD在2019臺北國際電腦展主題演講中公布多款領(lǐng)先的新一代產(chǎn)品

中國—2019年5月27日—AMD（NASDAQ:AMD）再次用技術(shù)創(chuàng)造了歷史，AMD總裁兼首席執(zhí)行官Lisa Su博士在臺北國際電腦展的開幕主題演講上首次公布了多款基于7nm制程的高性能計(jì)算和顯卡產(chǎn)品，預(yù)計(jì)將為PC游戲玩家、發(fā)燒友以及內(nèi)容創(chuàng)建者帶來更高水平的性能、技術(shù)和體驗(yàn)：

· 全新“Zen 2”核心大幅度提升了行業(yè)內(nèi)產(chǎn)品世代交替的性能提升水平， IPC（每時(shí)鐘周期指令）預(yù)計(jì)比“Zen”架構(gòu)提升高達(dá)15%

*。全新設(shè)計(jì)的“Zen 2”處理器核心為新一代AMD銳龍和EPYC（霄龍）處理器帶來大幅升級，包括更大的緩存容量和全新浮點(diǎn)運(yùn)算單元。

· 第三代AMD銳龍臺式機(jī)處理器系列，包括全新的12核銳龍9系列處理器，將提供優(yōu)異性能。

· AMD X570芯片組是世界首款支持PCIe4.0的芯片組，采用socket AM4架構(gòu)，同期將發(fā)布五十余款全新主板。

· RDNA游戲架構(gòu)旨在推動電腦游戲、游戲主機(jī)和云計(jì)算的未來，預(yù)計(jì)將在更小的封裝中實(shí)現(xiàn)難以置信的性能、功耗以及顯存效率提升。 

· 7nm AMD Radeon RX 5700系列游戲顯卡系列，具備高速GDDR6顯存，支持PCIe 4.0。

AMD總裁兼首席執(zhí)行官Lisa Su博士發(fā)表主題演講

與Lisa Su博士一起出席的還包括微軟平臺事業(yè)部副總裁Roanne Sones、華碩首席運(yùn)營官謝明杰、宏碁聯(lián)合首席運(yùn)營官Jerry Kao以及其他重要行業(yè)技術(shù)領(lǐng)袖，他們共同展示了AMD高性能計(jì)算和圖形生態(tài)系統(tǒng)的深遠(yuǎn)影響。

 Lisa Su博士表示：“2019年對AMD來說是令人難以置信的開始，AMD通過推出多款領(lǐng)先的產(chǎn)品來慶祝50年的創(chuàng)新歷程，并以此不斷挑戰(zhàn)計(jì)算機(jī)和圖形技術(shù)的極限。AMD對新一代核心、突破性的單封裝模塊化芯片設(shè)計(jì)（chiplet）和先進(jìn)的制程工藝進(jìn)行了重大戰(zhàn)略投資，這為公司高性能計(jì)算生態(tài)系統(tǒng)帶來了先進(jìn)的7nm制程產(chǎn)品。在準(zhǔn)備將新一代銳龍臺式機(jī)處理器、EPYC（霄龍）服務(wù)器處理器以及Radeon RX游戲顯卡推向市場之際，我們非常高興能和行業(yè)合作伙伴一起啟動2019臺北國際電腦展。

AMD高性能臺式機(jī)產(chǎn)品最新動態(tài)：

以引領(lǐng)PC產(chǎn)業(yè)之道為先，AMD公布了全球領(lǐng)先的第三代銳龍臺式機(jī)處理器，這款處理器在游戲、生產(chǎn)力和內(nèi)容創(chuàng)建應(yīng)用程序方面均具備開創(chuàng)性的性能?；谌隆癦en 2”單封裝模塊化芯片架構(gòu)（chiplet）的第三代AMD銳龍臺式機(jī)處理器預(yù)計(jì)將提供前所未有的核心緩存性能，以釋放精英級游戲動能。此外，全系第三代AMD銳龍臺式機(jī)處理器均已為世界首款PCIe 4.0接口提供完備支持，提供極為先進(jìn)的主板、顯卡以及存儲技術(shù)，打造全新性能標(biāo)桿并提供了極致的消費(fèi)者體驗(yàn)。

AMD還為第三代銳龍臺式機(jī)處理器全新打造了全新的銳龍9系列產(chǎn)品線，其旗艦型號為12核心/24線程的銳龍9 3900X，將以其卓越性能繼續(xù)推動高性能socket AM4平臺架構(gòu)。AMD同時(shí)還完善了8核心的銳龍7系列以及6核心的銳龍5系列產(chǎn)品。 

在主題演講中，Lisa Su博士還進(jìn)行了多項(xiàng)現(xiàn)場產(chǎn)品演示，以凸顯第三代AMD銳龍臺式機(jī)處理器的領(lǐng)先性能。

AMD總裁兼首席執(zhí)行官Lisa Su博士公布第三代AMD銳龍臺式機(jī)處理器

第三代AMD銳龍臺式機(jī)處理器參數(shù)以及上市時(shí)間：

AMD為socket AM4平臺推出了世界首款完備支持PCIe 4.0接口的全新X570芯片組，存儲性能將比PCIe 3.0快42%*，全面支持高性能顯卡、網(wǎng)絡(luò)設(shè)備、NVMe硬盤等PCIe產(chǎn)品。基于AMD X570芯片組的主板將比PCIe 3.0主板帶寬加倍*，電腦發(fā)燒友在構(gòu)建定制化系統(tǒng)時(shí)可獲得更高的性能和靈活性。 X570芯片組將為AMD打造前所未有的開放式生態(tài)系統(tǒng)。

華擎、華碩、七彩虹、技嘉、微星等板卡合作伙伴預(yù)計(jì)將推出五十余款全新X570主板，而影馳、技嘉和群聯(lián)電子等合作伙伴也將推出全新PCIe 4.0存儲解決方案。第三代AMD銳龍臺式機(jī)處理器預(yù)計(jì)將于2019年7月7日在全球上市。 

此外，包括宏碁、華碩、CyberPowerPC、惠普、聯(lián)想和MainGear在內(nèi)的眾多知名OEM廠商和系統(tǒng)集成商，也將在未來數(shù)月宣布其基于第三代AMD銳龍臺式機(jī)處理器的游戲桌面平臺計(jì)劃，以此繼續(xù)增強(qiáng)此全新平臺構(gòu)建的強(qiáng)大生態(tài)系統(tǒng)。

AMD和行業(yè)伙伴共襄盛舉 共同進(jìn)入7nm時(shí)代

AMD高性能游戲產(chǎn)品最新動態(tài)：

AMD還推出了新一代的基礎(chǔ)游戲架構(gòu)-RDNA，旨在推動未來幾年電腦游戲、游戲機(jī)和云游戲的發(fā)展。RDNA采用全新計(jì)算單元設(shè)計(jì)，與上一代GCN圖形核心架構(gòu)相比，RDNA預(yù)計(jì)將在更小封裝中提供不可思議的性能，功耗和顯存效率。與GCN圖形核心架構(gòu)相比，RDNA預(yù)計(jì)提供高達(dá)1.25倍的每時(shí)鐘性能和高達(dá)1.5倍的每瓦性能*，以更低功耗和更小延遲提供更好游戲性能。

即將推出的7nm AMD Radeon RX 5700系列顯卡采用RDNA架構(gòu)，配備高速GDDR6顯存并支持PCIe 4.0接口。

在主題演講中，Lisa Su博士展示了RDNA的強(qiáng)大性能，并且當(dāng)場使用一款A(yù)MD Radeon RX 5700顯卡展示了《奇異小隊(duì)》（Strange Brigade）游戲demo中的圖形性能，其性能表現(xiàn)不可思議，達(dá)到每秒100幀左右。

AMD總裁兼首席執(zhí)行官Lisa Su博士公布最新Radeon技術(shù)

AMD Radeon RX 5700系列顯卡預(yù)計(jì)將于2019年7月上市。請于太平洋時(shí)間2019年6月10日下午3點(diǎn)在AMD E3直播活動中了解更多細(xì)節(jié)。

AMD數(shù)據(jù)中心最新動態(tài)

AMD數(shù)據(jù)中心業(yè)務(wù)繼續(xù)贏得客戶青睞，在從最大的云環(huán)境到百億億級超級計(jì)算的工作負(fù)載中得到部署和應(yīng)用，并從AMD EPYC（霄龍）和AMD Radeon Instinct處理器所面臨的巨大市場機(jī)遇中獲益。

在主題演講中，Lisa Su博士首次公開進(jìn)行了第二代AMD EPYC（霄龍）服務(wù)器平臺的對比演示，繼續(xù)引起大家對下一代EPYC（霄龍）處理器的期待。

最后，AMD和Microsoft Azure宣布使用基于第一代AMD EPYC（霄龍）處理器的系統(tǒng)上運(yùn)行的Azure HB云實(shí)例，實(shí)現(xiàn)以前無法獲得的計(jì)算流體動力學(xué)（CFD）性能水平。利用AMD EPYC（霄龍）的出色內(nèi)存帶寬，Azure HB使用勒芒1億個(gè)單元模擬，在超過11,500個(gè)核心上擴(kuò)展了Siemens Star -CCM +應(yīng)用程序，遠(yuǎn)超以前從未達(dá)到的10,000核心目標(biāo)。微軟Azure虛擬機(jī)產(chǎn)品負(fù)責(zé)人Navneet Joneja表示：“Azure上的HB系列虛擬機(jī)（VM）改變了云上高性能計(jì)算（HPC）的游戲規(guī)則。第一次HPC客戶可以將其MPI工作負(fù)載擴(kuò)展到數(shù)萬個(gè)核心，并具有堪比本地部署集群的云靈活性、性能和經(jīng)濟(jì)性。我們期待這款新的Azure云實(shí)例能夠?yàn)镠PC驅(qū)動的創(chuàng)新和生產(chǎn)力做出巨大貢獻(xiàn)?！?/p>

與上一代產(chǎn)品相比，第二代AMD EPYC（霄龍）服務(wù)器處理器系列將提供高達(dá)每插槽2倍的性能和高達(dá)4倍的浮點(diǎn)性能。*

第二代AMD EPYC（霄龍）服務(wù)器處理器系列預(yù)計(jì)將于2019年第三季度推出。

參考資訊：

l 訪問AMD臺北國際電腦展網(wǎng)頁回看主題演講，視頻以及產(chǎn)品細(xì)節(jié)

l 標(biāo)注*的所有產(chǎn)品運(yùn)行數(shù)據(jù)、現(xiàn)場演示成績或結(jié)果均出自AMD實(shí)驗(yàn)室或?qū)嶋H現(xiàn)場演示，請聯(lián)系A(chǔ)MD獲取更多資訊

關(guān)于 AMD

50年來，AMD引領(lǐng)了高性能運(yùn)算、圖形，以及可視化技術(shù)方面的創(chuàng)新，這些都是游戲、臨境感平臺以及數(shù)據(jù)中心的基礎(chǔ)。每時(shí)每刻，全球數(shù)百萬的消費(fèi)者、500強(qiáng)公司，以及尖端科學(xué)研究所都依靠AMD技術(shù)來改善他們的生活、工作以及娛樂。AMD全球員工致力于打造偉大的產(chǎn)品，努力拓寬技術(shù)的極限。成就今日，啟迪未來。更多信息，敬請?jiān)L問AMD公司（NASDAQ：AMD）官網(wǎng)www.amd.com.cn關(guān)注AMD官方微信: AMDChina，關(guān)注AMD官方微博@AMD中國。

Cautionary Statement

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the features, functionality, availability, timing, deployment and expectations of AMD’s future products, including 3rd Gen AMD Ryzen desktop processors, 7nm AMD Radeon RX 5700-series graphics cards and the 2nd Gen AMD EPYC server processor family, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "intends," "believes," "expects," "may," "will," "should," "seeks," "intends," "plans," "pro forma," "estimates," "anticipates," or the negative of these words and phrases, other variations of these words and phrases or comparable terminology. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices may limit AMD’s ability to compete effectively; AMD has a wafer supply agreement with GLOBALFOUNDRIES Inc. (GF) with obligations to purchase all of its microprocessor and APU product requirements, and a certain portion of its GPU product requirements, manufactured at process nodes larger than 7 nanometer from GF with limited exceptions. If GF is not able to satisfy AMD’s manufacturing requirements, AMD’s business could be adversely impacted; AMD relies on third parties to manufacture its products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, AMD’s business could be materially adversely affected; failure to achieve expected manufacturing yields for AMD’s products could negatively impact its financial results; the success of AMD’s business is dependent upon its ability to introduce products on a timely basis with features and performance levels that provide value to its customers while supporting and coinciding with significant industry transitions; if AMD cannot generate sufficient revenue and operating cash flow or obtain external financing, it may face a cash shortfall and be unable to make all of its planned investments in research and development or other strategic investments; the loss of a significant customer may have a material adverse effect on AMD; AMD’s receipt of revenue from its semi-custom SoC products is dependent upon its technology being designed into third-party products and the success of those products; global economic and market uncertainty may adversely impact AMD’s business and operating results; AMD’s products may be subject to security vulnerabilities that could have a material adverse effect on AMD; IT outages, data loss, data breaches and cyber-attacks could compromise AMD’s intellectual property or other sensitive information, be costly to remediate and cause significant damage to its business, reputation and operations; AMD’s operating results are subject to quarterly and seasonal sales patterns; AMD may not be able to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD has a large amount of indebtedness which could adversely affect its financial position and prevent it from implementing its strategy or fulfilling its contractual obligations; the agreements governing AMD’s notes and the Secured Revolving Line of Credit impose restrictions on AMD that may adversely affect AMD’s ability to operate its business; the markets in which AMD’s products are sold are highly competitive; AMD’s worldwide operations are subject to political, legal and economic risks and natural disasters, which could have a material adverse effect on it; the conversion of the 2.125% Convertible Senior Notes due 2026 may dilute the ownership interest of AMD’s existing stockholders, or may otherwise depress the price of its common stock; uncertainties involving the ordering and shipment of AMD’s products could materially adversely affect it; the demand for AMD’s products depends in part on the market conditions in the industries into which they are sold. Fluctuations in demand for AMD’s products or a market decline in any of these industries could have a material adverse effect on its results of operations; AMD’s ability to design and introduce new products in a timely manner is dependent upon third-party intellectual property; AMD depends on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components to support its business; if AMD loses Microsoft Corporation’s support for its products or other software vendors do not design and develop software to run on AMD’s products, its ability to sell its products could be materially adversely affected; and AMD’s reliance on third-party distributors and add-in-board partners subjects it to certain risks.  Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended March 30, 2019.

AMD, the AMD Arrow logo, EPYC, Ryzen, Radeon and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.